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dc.contributor.authorP. Punnakitikashemen_US
dc.contributor.authorP. Intarakumnerden_US
dc.contributor.authorT. Laosirihongthongen_US
dc.contributor.otherMahidol Universityen_US
dc.contributor.otherThammasat Universityen_US
dc.date.accessioned2018-09-24T08:59:11Z-
dc.date.available2018-09-24T08:59:11Z-
dc.date.issued2010-12-01en_US
dc.identifier.citationIEEM2010 - IEEE International Conference on Industrial Engineering and Engineering Management. (2010), 1027-1031en_US
dc.identifier.other2-s2.0-78751700184en_US
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=78751700184&origin=inwarden_US
dc.identifier.urihttp://repository.li.mahidol.ac.th/dspace/handle/123456789/29063-
dc.description.abstractTechnology transfer is a mechanism to acquire technology and helps company to enhance their technology capabilities. The purpose of this study is to demonstrate how Data Envelopment Analysis (DEA) can be used to assess performance of technology transfer project at firm level. Data collected from transferring the robotics operating technology project of 12 automotive parts/components manufacturing companies are examined by using the DEA model. The results of this study show that six companies carried out efficient technology transferring. The average efficiency score of technology transfer project is 93.3%. This finding confirms that absorptive capacity of recipient firms is a critical success factor underlying differences between efficient and inefficient firms. DEA method provides Chief Technology Officers (CTO) or project leaders a framework to determine appropriate transferring mechanisms and necessary internal and external resources. ©2010 IEEE.en_US
dc.rightsMahidol Universityen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=78751700184&origin=inwarden_US
dc.subjectEngineeringen_US
dc.titlePerformance assessment of technology transfer project: An application of DEA techniqueen_US
dc.typeConference Paperen_US
dc.rights.holderSCOPUSen_US
dc.identifier.doi10.1109/IEEM.2010.5674233en_US
Appears in Collections:Scopus 2006-2010

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