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Please use this identifier to cite or link to this item: http://repository.li.mahidol.ac.th/dspace/handle/123456789/33784
Title: Effect of evaporation on the shelf life of a universal adhesive
Authors: Pong Pongprueksa
Vesna Miletic
Jan De Munck
Neil R. Brooks
Filip Meersman
Erik Nies
Bart D. Van Meerbeek
Kirsten L. Van Landuyt
KU Leuven– University Hospital Leuven
Mahidol University
University of Belgrade
KU Leuven
Keywords: Dentistry
Issue Date: 1-Jan-2014
Citation: Operative Dentistry. Vol.39, No.5 (2014), 500-507
Abstract: ©Operative Dentistry Objectives: The purpose of this study was to evaluate how evaporation affects the shelf life of a one-bottle universal adhesive. Methods: Three different versions of Scotchbond Universal (SBU, 3M ESPE, Seefeld, Germany) were prepared using a weight-loss technique. SBU0 was left open to the air until maximal weight loss was obtained, whereas SBU50 was left open until 50% of evaporation occurred. In contrast, SBU100 was kept closed and was assumed to contain the maximum concentration of all ingredients. The degree of conversion (DC) was determined by using Fourier transform infrared spectroscopy on different substrates (on dentin or glass plate and mixed with dentin powder); ultimate microtensile strength and microtensile bond strength to dentin were measured as well. Results: DC of the 100% solvent-containing adhesive (SBU100) was higher than that of the 50% (SBU50) and 0% (SBU0) solvent-containing adhesives for all substrates. DC of the adhesive applied onto glass and dehydrated dentin was higher than that applied onto dentin. Even though the ultimate microtensile strength of SBU0 was much higher than that of SBU50 and SBU100, its bond strength to dentin was significantly lower. Conclusions: Evaporation of adhesive ingredients may jeopardize the shelf life of a onebottle universal system by reducing the degree of conversion and impairing bond strength. However, negative effects only became evident after more than 50% evaporation.
URI: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84908576424&origin=inward
http://repository.li.mahidol.ac.th/dspace/handle/123456789/33784
ISSN: 03617734
Appears in Collections:Scopus 2011-2015

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