Publication:
Capital structure, cost of debt and dividend payout of firms in New York and Shanghai stock exchanges

dc.contributor.authorJun Jiangen_US
dc.contributor.authorKomain Jiranyakulen_US
dc.contributor.otherMahidol Universityen_US
dc.contributor.otherThailand National Institute of Development Administrationen_US
dc.date.accessioned2018-10-19T04:53:54Z
dc.date.available2018-10-19T04:53:54Z
dc.date.issued2013-01-01en_US
dc.description.abstract© 2013, Econjournals. All rights reserved. The Study collects panel data of listed firms in New York Stock and Shanghai Stock Exchanges during 1992 to 2008. The data are used to perform panel regression estimates for firms in each stock market. The main purpose is to compare the decision on dividend payout of listed firms in the two stock markets. The results from fixed effect estimates show that factors that can explain dividend payout of firms in New York Stock Exchange poorly explain dividend payout of firms in Shanghai Stock Exchange. This paper adds to the literature in that it provides an evidence of difference in dividend policy of firms between advanced and emerging stock markets. For policymakers in the Chinese economy, implementation of measures to enhance the advancement of bond market is necessary. Additionally, firms in Shanghai Stock Exchange should adjust their capital structure to provide room for investors to diversify and adjust their portfolios of stocks and bonds.en_US
dc.identifier.citationInternational Journal of Economics and Financial Issues. Vol.3, No.1 (2013), 113-121en_US
dc.identifier.issn21464138en_US
dc.identifier.other2-s2.0-84979798567en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/31708
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84979798567&origin=inwarden_US
dc.subjectEconomics, Econometrics and Financeen_US
dc.titleCapital structure, cost of debt and dividend payout of firms in New York and Shanghai stock exchangesen_US
dc.typeArticleen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84979798567&origin=inwarden_US

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