Publication:
Technology development envelope approach for the adoption of future powertrain technologies: A case study on ford otosan roadmapping model

dc.contributor.authorTugrul Daimen_US
dc.contributor.authorNathasit Gerdsrien_US
dc.contributor.authorIrmak Kockanen_US
dc.contributor.authorDundar Kocaogluen_US
dc.contributor.otherPortland State Universityen_US
dc.contributor.otherMahidol Universityen_US
dc.contributor.otherIstanbul Teknik Universitesien_US
dc.date.accessioned2018-05-03T08:09:28Z
dc.date.available2018-05-03T08:09:28Z
dc.date.issued2011-04-01en_US
dc.description.abstractIndustry, government, and academia have started to adopt the technology roadmapping concept to setup their technology strategy, identify gaps and opportunities in their R & D activities. Automotive industry, facing fierce competition with continuous technological breakthroughs and improvements, should have roadmaps with respect to their company objectives that have flexible features so that organizations can reassess and adjust their roadmaps in a timely manner according to the impacts of the changes. This study focuses on future powertrain systems with the aim of defining the most probable implementation roadmap for the different alternatives to improve powertrain efficiency.en_US
dc.identifier.citationJiaotong Yunshu Xitong Gongcheng Yu Xinxi/Journal of Transportation Systems Engineering and Information Technology. Vol.11, No.2 (2011), 58-69en_US
dc.identifier.issn10096744en_US
dc.identifier.other2-s2.0-79956097460en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/11804
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=79956097460&origin=inwarden_US
dc.subjectComputer Scienceen_US
dc.subjectEngineeringen_US
dc.subjectMathematicsen_US
dc.subjectSocial Sciencesen_US
dc.titleTechnology development envelope approach for the adoption of future powertrain technologies: A case study on ford otosan roadmapping modelen_US
dc.typeArticleen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=79956097460&origin=inwarden_US

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