Publication:
Mini-interfacial fracture toughness as a new validated enamel-bonding effectiveness test

dc.contributor.authorPong Pongprueksaen_US
dc.contributor.authorJan De Muncken_US
dc.contributor.authorBruno C. Barretoen_US
dc.contributor.authorKavin Karunratanakulen_US
dc.contributor.authorBart Van Meerbeeken_US
dc.contributor.otherKU Leuven– University Hospital Leuvenen_US
dc.contributor.otherMahidol Universityen_US
dc.contributor.otherKU Leuvenen_US
dc.contributor.otherThailand National Metal and Materials Technology Centeren_US
dc.date.accessioned2018-12-11T02:47:15Z
dc.date.accessioned2019-03-14T08:01:26Z
dc.date.available2018-12-11T02:47:15Z
dc.date.available2019-03-14T08:01:26Z
dc.date.issued2016-09-01en_US
dc.description.abstract© 2016 Elsevier Ltd. Today's most commonly applied bonding effectiveness tests are criticized for their high variability and low reliability, the latter in particular with regard to measuring the actual strength of the adhesive interface. Objectives: in continuation of previous research conducted at dentin, we hereby aimed to validate the novel mini-interfacial fracture toughness (mini-iFT) test on its applicability to assess bonding effectiveness of contemporary adhesives when bonded to enamel. Methods: The 3-step etch&rinse (E&R) adhesive OptiBond FL (Kerr), the 2-step self-etch (SE) adhesive Clearfil SE Bond (Kuraray Noritake) and the two multi-mode adhesives Clearfil S3Bond Plus (Kuraray Noritake) and Scotchbond Universal (3M ESPE), both used following a 2-step E&R and 1-step SE mode, were applied to clinically relevant, flattened enamel surfaces. A composite (Filtek Z100; 3M ESPE) build-up was made in layers. After 1-week water storage at 37 °C, all specimens were sectioned perpendicular to the interface to obtain rectangular sticks. A mini-iFT notch was prepared at the adhesive-enamel interface using a thin diamond blade under water cooling. Finally, the specimens were loaded in a 4-point bending test until failure. Results: the mini-iFT onto human enamel was significantly higher for the adhesives applied in E&R mode versus those applied in SE mode. The lowest mini-iFT was found for the adhesives applied following a 1-step SE approach. SEM fracture analysis revealed that all fractures originated at the adhesive-enamel interface and that the induced crack propagated preferentially along this interface. Conclusion: mini-iFT appeared a valid alternative method to assess the mechanical properties of adhesive-enamel interfaces.en_US
dc.identifier.citationJournal of the Mechanical Behavior of Biomedical Materials. Vol.62, (2016), 446-455en_US
dc.identifier.doi10.1016/j.jmbbm.2016.05.022en_US
dc.identifier.issn18780180en_US
dc.identifier.issn17516161en_US
dc.identifier.other2-s2.0-84973165266en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/40581
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84973165266&origin=inwarden_US
dc.subjectEngineeringen_US
dc.subjectMaterials Scienceen_US
dc.titleMini-interfacial fracture toughness as a new validated enamel-bonding effectiveness testen_US
dc.typeArticleen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84973165266&origin=inwarden_US

Files

Collections