Publication: Prevention of periimplant skin inflammation using an acrylic resin housing with a tunnel design for an implant-retained auricular prosthesis
dc.contributor.author | Hai Hoang Phan | en_US |
dc.contributor.author | Natdhanai Chotprasert | en_US |
dc.contributor.author | Prana Shakya | en_US |
dc.contributor.author | M. L.Theerathavaj Srithavaj | en_US |
dc.contributor.other | Mahidol University | en_US |
dc.date.accessioned | 2018-12-21T07:25:12Z | |
dc.date.accessioned | 2019-03-14T08:03:29Z | |
dc.date.available | 2018-12-21T07:25:12Z | |
dc.date.available | 2019-03-14T08:03:29Z | |
dc.date.issued | 2017-09-01 | en_US |
dc.description.abstract | © 2016 Editorial Council for the Journal of Prosthetic Dentistry Implant-retained auricular prostheses offer better retention than conventional adhesive retentive methods. Periimplant skin inflammation, which results from improper substructure design, poor hygiene, skin thickness, and the hot and moist environment around abutments, however, is a common complication of craniofacial implants. This article describes a technique for fabricating an acrylic resin housing design with an extended arm to improve ventilation around implants and to reduce the risk of the silicone prosthesis tearing away from the acrylic resin housing. | en_US |
dc.identifier.citation | Journal of Prosthetic Dentistry. Vol.118, No.3 (2017), 437-441 | en_US |
dc.identifier.doi | 10.1016/j.prosdent.2016.10.012 | en_US |
dc.identifier.issn | 00223913 | en_US |
dc.identifier.other | 2-s2.0-85011049797 | en_US |
dc.identifier.uri | https://repository.li.mahidol.ac.th/handle/20.500.14594/42430 | |
dc.rights | Mahidol University | en_US |
dc.rights.holder | SCOPUS | en_US |
dc.source.uri | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85011049797&origin=inward | en_US |
dc.subject | Dentistry | en_US |
dc.title | Prevention of periimplant skin inflammation using an acrylic resin housing with a tunnel design for an implant-retained auricular prosthesis | en_US |
dc.type | Article | en_US |
dspace.entity.type | Publication | |
mu.datasource.scopus | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85011049797&origin=inward | en_US |