Publication:
The Contact Patch Analysis of Solid Tire on Drum Testing by Finite Element Method

dc.contributor.authorJ. Phromjanen_US
dc.contributor.authorC. Suvanjumraten_US
dc.contributor.otherMahidol Universityen_US
dc.date.accessioned2020-10-05T04:54:10Z
dc.date.available2020-10-05T04:54:10Z
dc.date.issued2020-07-27en_US
dc.description.abstract© Published under licence by IOP Publishing Ltd. The drum testing method is an effective method to study the tire-rotating characteristic. The rolling resistance and contact force are carried out for tire performance development. The tire was tested by the cylindrical drum indoor laboratory. Thus, the contact patch of rolling solid tire on the drum surface should provide the same results as the tire testing on a flat surface. This research uses a finite element method to develop the drum testing of solid tire model and to investigate the contact patch. The compressed contact patches of solid tire on drum were compared with the validated contact patches of solid tire on the flat surface. The different results showed the effect of the drum curvature. Consequently, the diameter of the drum wheel was optimized for solid tire testing. It is interesting to note that the suitable ratio between drum diameter and solid tire diameter was 1.81.en_US
dc.identifier.citationIOP Conference Series: Materials Science and Engineering. Vol.886, No.1 (2020)en_US
dc.identifier.doi10.1088/1757-899X/886/1/012049en_US
dc.identifier.issn1757899Xen_US
dc.identifier.issn17578981en_US
dc.identifier.other2-s2.0-85090293563en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/59063
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85090293563&origin=inwarden_US
dc.subjectEngineeringen_US
dc.subjectMaterials Scienceen_US
dc.titleThe Contact Patch Analysis of Solid Tire on Drum Testing by Finite Element Methoden_US
dc.typeConference Paperen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85090293563&origin=inwarden_US

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