Publication:
Solution plasma applications for the synthesis/modification of inorganic nanostructured materials and the treatment of natural polymers

dc.contributor.authorAnyarat Watthanaphaniten_US
dc.contributor.authorNagahiro Saitoen_US
dc.contributor.otherMahidol Universityen_US
dc.contributor.otherNagoya Universityen_US
dc.date.accessioned2019-08-23T11:10:14Z
dc.date.available2019-08-23T11:10:14Z
dc.date.issued2018-01-01en_US
dc.description.abstract© 2018 The Japan Society of Applied Physics. Reducing the use of toxic chemicals, production steps, and time consumption are important concerns for researchers and process engineers to contribute in the quest for an efficient process in any production. If an equipment setup is simple, the process additionally becomes more profitable. Combination of the mentioned requirements has opened up various applications of the solution plasma process (SPP) - a physical means of generating plasma through an electrical discharge in a liquid medium at atmospheric pressure and room temperature. This review shows the progress of scientific research on the applications of the SPP for the synthesis/modification of inorganic nanostructured materials and the treatment of natural polymers. Development achieved in each application is demonstrated.en_US
dc.identifier.citationJapanese Journal of Applied Physics. Vol.57, No.1 (2018)en_US
dc.identifier.doi10.7567/JJAP.57.0102A3en_US
dc.identifier.issn13474065en_US
dc.identifier.issn00214922en_US
dc.identifier.other2-s2.0-85040353217en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/45853
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85040353217&origin=inwarden_US
dc.subjectEngineeringen_US
dc.subjectPhysics and Astronomyen_US
dc.titleSolution plasma applications for the synthesis/modification of inorganic nanostructured materials and the treatment of natural polymersen_US
dc.typeReviewen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85040353217&origin=inwarden_US

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