Publication:
Characterization of purified SKIM rubber by alkali treatment for pressure sensitive adhesive application

dc.contributor.authorK. Nawamawaten_US
dc.contributor.authorJ. T. Sakdapipanichen_US
dc.contributor.authorN. Phuphewkeawen_US
dc.contributor.otherMahidol Universityen_US
dc.date.accessioned2018-07-12T02:21:29Z
dc.date.available2018-07-12T02:21:29Z
dc.date.issued2008-04-01en_US
dc.description.abstractDue to the lack of gel phase skim rubber (SK) shows a good solubility. Consequently, this material was approached to the aspect of pressure sensitive adhesive applications. Saponification by alkali treatment was applied to remove non-rubber components in SK. The suitable reaction time and temperature for preparing highly-purified SK (HPSK) were established. The nitrogen content in SK was reduced to ca. 0.1%w/w, whereas the ester content slightly decreased. The tackiness and the adhesion properties of HPSK were evaluated by the rolling ball method and 180° peel tests, respectively. Proteins were found to be an important factor controlling tackiness property, while the adhesion property depended on both proteins and phospholipids. The pressure sensitive adhesive prepared from ribbed-smoke sheet (RSS) was also studied in comparison. The comparable in tackiness and adhesion properties of adhesive tapes prepared from RSS and HPSK suggested that the later could be used efficiently as raw material for pressure sensitive adhesives.en_US
dc.identifier.citationKGK Kautschuk Gummi Kunststoffe. Vol.61, No.4 (2008), 147-151en_US
dc.identifier.issn09483276en_US
dc.identifier.other2-s2.0-42449147550en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/19045
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=42449147550&origin=inwarden_US
dc.subjectChemical Engineeringen_US
dc.subjectMaterials Scienceen_US
dc.titleCharacterization of purified SKIM rubber by alkali treatment for pressure sensitive adhesive applicationen_US
dc.typeArticleen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=42449147550&origin=inwarden_US

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