Publication:
An analytical approach to building a Technology Development Envelope (TDE) for roadmapping of emerging technologies

dc.contributor.authorNathasit Gerdsrien_US
dc.contributor.otherPortland State Universityen_US
dc.contributor.otherMahidol Universityen_US
dc.date.accessioned2019-08-23T10:43:07Z
dc.date.available2019-08-23T10:43:07Z
dc.date.issued2018-02-14en_US
dc.description.abstract© 2018 by World Scientific Publishing Co. Pte. Ltd. All rights reserved. This chapter presents the research on the development of a new concept and methodology called Technology Development Envelope (TDE). The TDE approach is applied to identify the optimum path in developing a technology roadmap in which the company's technology strategies and business strategies are combined. TDE allows the executive level decision makers in corporations, as well as the policy level decision makers in governments to incorporate emerging technologies into the development of technology strategies. The combination of Delphi method and Hierarchical Decision Modeling (HDM) is used as a foundation for building the TDE concept. The judgments from technology developers and technology implementers are utilized in the process to ensure that the technology strategies are in full support of corporate goals and objectives.en_US
dc.identifier.citationTechnology Roadmapping. (2018), 585-608en_US
dc.identifier.doi10.1142/9789813235342en_US
dc.identifier.other2-s2.0-85058892194en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/45375
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85058892194&origin=inwarden_US
dc.subjectBusiness, Management and Accountingen_US
dc.subjectEconomics, Econometrics and Financeen_US
dc.subjectEngineeringen_US
dc.titleAn analytical approach to building a Technology Development Envelope (TDE) for roadmapping of emerging technologiesen_US
dc.typeChapteren_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85058892194&origin=inwarden_US

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