Publication:
Elution study of three light-cured orthodontic adhesives

dc.contributor.authorPitchaya Roongrujimeken_US
dc.contributor.authorNiwat Anuwongnukrohen_US
dc.contributor.authorSurachai Dechkunakornen_US
dc.contributor.otherMahidol Universityen_US
dc.date.accessioned2020-01-27T09:10:04Z
dc.date.available2020-01-27T09:10:04Z
dc.date.issued2019-01-01en_US
dc.description.abstract© 2019 Trans Tech Publications Ltd, Switzerland. Objectives: The aim of the study was to evaluate monomer elution from three commercial orthodontic adhesive pastes. Methods: Three monomers BPA, Bis-GMA, and TEGDMA were observed from Green Glue (Hangzhou Westlake Biomaterials Co., Zhejiang, China), GrenGloo (Ormco Co., Glendora, CA, USA), and Transbond XT (3M Unitek, St. Paul, MN, USA). The adhesive was light-cured in a cylindrical mold with 6 mm in diameter and 2 mm thick, before immediately immerse into 10 ml extraction media of 75%ethanol in a tightly sealed container at 37°C. The solution was refreshed at four intervals of time 1, 3, 5, and 7 d. The immersion medium was determined using High-performance liquid chromatography (HPLC). Results and Conclusions: BPA were found from three adhesives. Bis-GMA was found only from Transbond XT. TEGDMA were found from both Green Glue and Grengloo. Green Glue had 10-30 times higher TEGDMA elution than Grengloo. Major elution was found from all orthodontic adhesive paste within 1 d, and decrease with time to 7 d.en_US
dc.identifier.citationSolid State Phenomena. Vol.294 SSP, (2019), 59-64en_US
dc.identifier.doi10.4028/www.scientific.net/SSP.294.59en_US
dc.identifier.issn16629779en_US
dc.identifier.other2-s2.0-85071863662en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/51183
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85071863662&origin=inwarden_US
dc.subjectMaterials Scienceen_US
dc.titleElution study of three light-cured orthodontic adhesivesen_US
dc.typeConference Paperen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85071863662&origin=inwarden_US

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