Publication: Elution study of three light-cured orthodontic adhesives
dc.contributor.author | Pitchaya Roongrujimek | en_US |
dc.contributor.author | Niwat Anuwongnukroh | en_US |
dc.contributor.author | Surachai Dechkunakorn | en_US |
dc.contributor.other | Mahidol University | en_US |
dc.date.accessioned | 2020-01-27T09:10:04Z | |
dc.date.available | 2020-01-27T09:10:04Z | |
dc.date.issued | 2019-01-01 | en_US |
dc.description.abstract | © 2019 Trans Tech Publications Ltd, Switzerland. Objectives: The aim of the study was to evaluate monomer elution from three commercial orthodontic adhesive pastes. Methods: Three monomers BPA, Bis-GMA, and TEGDMA were observed from Green Glue (Hangzhou Westlake Biomaterials Co., Zhejiang, China), GrenGloo (Ormco Co., Glendora, CA, USA), and Transbond XT (3M Unitek, St. Paul, MN, USA). The adhesive was light-cured in a cylindrical mold with 6 mm in diameter and 2 mm thick, before immediately immerse into 10 ml extraction media of 75%ethanol in a tightly sealed container at 37°C. The solution was refreshed at four intervals of time 1, 3, 5, and 7 d. The immersion medium was determined using High-performance liquid chromatography (HPLC). Results and Conclusions: BPA were found from three adhesives. Bis-GMA was found only from Transbond XT. TEGDMA were found from both Green Glue and Grengloo. Green Glue had 10-30 times higher TEGDMA elution than Grengloo. Major elution was found from all orthodontic adhesive paste within 1 d, and decrease with time to 7 d. | en_US |
dc.identifier.citation | Solid State Phenomena. Vol.294 SSP, (2019), 59-64 | en_US |
dc.identifier.doi | 10.4028/www.scientific.net/SSP.294.59 | en_US |
dc.identifier.issn | 16629779 | en_US |
dc.identifier.other | 2-s2.0-85071863662 | en_US |
dc.identifier.uri | https://repository.li.mahidol.ac.th/handle/20.500.14594/51183 | |
dc.rights | Mahidol University | en_US |
dc.rights.holder | SCOPUS | en_US |
dc.source.uri | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85071863662&origin=inward | en_US |
dc.subject | Materials Science | en_US |
dc.title | Elution study of three light-cured orthodontic adhesives | en_US |
dc.type | Conference Paper | en_US |
dspace.entity.type | Publication | |
mu.datasource.scopus | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85071863662&origin=inward | en_US |