Publication:
Sensitivity and packaging improvement of an LCP pressure sensor for intracranial pressure measurement via FEM simulation

dc.contributor.authorPreedipat Sattayasoonthornen_US
dc.contributor.authorJackrit Suthakornen_US
dc.contributor.authorSorayouth Chamnanvejen_US
dc.contributor.otherMahidol Universityen_US
dc.date.accessioned2020-01-27T08:18:16Z
dc.date.available2020-01-27T08:18:16Z
dc.date.issued2019-10-01en_US
dc.description.abstractCopyright © 2019 Institute of Advanced Engineering and Science. All rights reserved. A biocompatible liquid crystal polymer (LCP) pressure sensor is proposed for measuring intracranial pressure (ICP) in Traumatic Brain Injury (TBI) patients. Finite element method using COMSOL multiphysics is employed to study the mechanical behavior of the packaged LCP pressure sensor in order to optimize the sensor design. A 3D model of the 8x8x0.2 mm LCP pressure sensor is simulated to investigate the parameters that significantly influence the sensor characteristics under the uniform pressure range of 0 to 50 mmHg. The simulation results of the new design are compared to the experimental results from a previous design. The result shows that reducing the thickness of the sensing membrane can increase the sensitivity up to six times of that previously reported. An improvement of fabrication methodology is proposed to complete the LCP packaging.en_US
dc.identifier.citationInternational Journal of Electrical and Computer Engineering. Vol.9, No.5 (2019), 4044-4052en_US
dc.identifier.doi10.11591/ijece.v9i5.pp4044-4052en_US
dc.identifier.issn20888708en_US
dc.identifier.other2-s2.0-85067597281en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/50602
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85067597281&origin=inwarden_US
dc.subjectComputer Scienceen_US
dc.subjectEngineeringen_US
dc.titleSensitivity and packaging improvement of an LCP pressure sensor for intracranial pressure measurement via FEM simulationen_US
dc.typeArticleen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85067597281&origin=inwarden_US

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