Publication:
Study of low power deposition of ITO for top emission oled with facing target and RF sputtering systems

dc.contributor.authorS. Dangtipen_US
dc.contributor.authorY. Hoshien_US
dc.contributor.authorY. Kasaharaen_US
dc.contributor.authorY. Onaien_US
dc.contributor.authorT. Osotchanen_US
dc.contributor.authorY. Sawadaen_US
dc.contributor.authorT. Uchidaen_US
dc.contributor.otherMahidol Universityen_US
dc.contributor.otherTokyo Polytechnic Universityen_US
dc.date.accessioned2018-07-12T02:52:46Z
dc.date.available2018-07-12T02:52:46Z
dc.date.issued2008-03-01en_US
dc.description.abstractDeposition of ITO as top transparent electrode was studied using two deposition systems with and without direct contact to working plasma; namely with conventional RF-magnetron planar (RSS) and pulsed-DC facing target sputtering systems (FTS). Test devices were made on glass substrates and consisted of (from bottom up) ITO/4 Organic Layers/ITO. Depositions were performed at low deposition powers; 30 and 60 watts, to reduce damages by energetic sputtered particles to underlying organic layers. Test devices from both sputtering systems were found to function well. Leakage current density at -5 V reverse bias were relatively constant from 0.3 and 0.4 mA/cm2at 30 W and 60 W in FTS, while the values were found to increase from 0.001 to 0.2mA/cm2at 30 W and 60 W in RSS. © 2008 IOP Publishing Ltd.en_US
dc.identifier.citationJournal of Physics: Conference Series. Vol.100, No.PART 4 (2008)en_US
dc.identifier.doi10.1088/1742-6596/100/4/042011en_US
dc.identifier.issn17426596en_US
dc.identifier.issn17426588en_US
dc.identifier.other2-s2.0-77954336216en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/19895
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=77954336216&origin=inwarden_US
dc.subjectPhysics and Astronomyen_US
dc.titleStudy of low power deposition of ITO for top emission oled with facing target and RF sputtering systemsen_US
dc.typeConference Paperen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=77954336216&origin=inwarden_US

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