Publication: Transient response of thermoelastic bodies linked by a thin layer of low stiffness and high thermal resistivity
dc.contributor.author | Christian Licht | en_US |
dc.contributor.author | Ahmed Ould Khaoua | en_US |
dc.contributor.author | Thibaut Weller | en_US |
dc.contributor.other | Universite de Montpellier | en_US |
dc.contributor.other | Mahidol University | en_US |
dc.contributor.other | South Carolina Commission on Higher Education | en_US |
dc.contributor.other | Universidad de Los Andes, Colombia | en_US |
dc.date.accessioned | 2018-11-23T10:09:15Z | |
dc.date.available | 2018-11-23T10:09:15Z | |
dc.date.issued | 2015-01-01 | en_US |
dc.description.abstract | © 2014 Académie des sciences. We extend to the thermoelastic case the study [1] devoted to the dynamic response of a structure made of two linearly elastic bodies linked by a thin soft adhesive linearly elastic layer. Once again, a formulation in terms of an evolution equation in a Hilbert space of possible states with finite energy makes it possible to identify the asymptotic behavior, when some geometrical and thermomechanical parameters tend to their natural limits, as the response of two bodies linked by a thermomechanical constraint. The genuine thermomechanical coupling remains in the constraint law only for a specific relative behavior of the parameters. | en_US |
dc.identifier.citation | Comptes Rendus - Mecanique. Vol.343, No.1 (2015), 18-26 | en_US |
dc.identifier.doi | 10.1016/j.crme.2014.09.005 | en_US |
dc.identifier.issn | 16310721 | en_US |
dc.identifier.other | 2-s2.0-84920703105 | en_US |
dc.identifier.uri | https://repository.li.mahidol.ac.th/handle/20.500.14594/35971 | |
dc.rights | Mahidol University | en_US |
dc.rights.holder | SCOPUS | en_US |
dc.source.uri | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84920703105&origin=inward | en_US |
dc.subject | Engineering | en_US |
dc.subject | Materials Science | en_US |
dc.title | Transient response of thermoelastic bodies linked by a thin layer of low stiffness and high thermal resistivity | en_US |
dc.type | Article | en_US |
dspace.entity.type | Publication | |
mu.datasource.scopus | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84920703105&origin=inward | en_US |