Publication:
Improved anti-dust mite properties of textiles by eugenol loaded chitosan nanoparticles

dc.contributor.authorSanitra Jarupaiboonen_US
dc.contributor.authorKanin Rungsardthongen_US
dc.contributor.authorIssara Sramalaen_US
dc.contributor.authorWiyong Kangwansupamonkonen_US
dc.contributor.authorSatit Puttipipatkhachornen_US
dc.contributor.authorUracha Ruktanonchaien_US
dc.contributor.otherThailand National Science and Technology Development Agencyen_US
dc.contributor.otherMahidol Universityen_US
dc.date.accessioned2018-08-24T01:48:11Z
dc.date.available2018-08-24T01:48:11Z
dc.date.issued2007-08-28en_US
dc.description.abstractRecently polymeric nanoparticles have been widely explored as a carrier for a wide application including drug delivery. Eugenol loaded chitosan nanoparticles were prepared by ionic gelation method between cationic chitosan and anionic tripolyphosphate (TPP). The size and eugenol entrapment efficiency of prepared nanoparticles were strongly dependent on molecular weight of chitosan, degree of deacetylation of chitosan, weight ratio between chitosan and TPP and % loading of eugenol. The nanoparticles coated cotton fabric demonstrated activity against dust mite viability, indicating improved anti-dust mite properties of textile materials. © 2007 IEEE.en_US
dc.identifier.citationProceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. (2007), 1016-1019en_US
dc.identifier.doi10.1109/NEMS.2007.352190en_US
dc.identifier.other2-s2.0-34548120159en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/24399
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=34548120159&origin=inwarden_US
dc.subjectComputer Scienceen_US
dc.subjectEngineeringen_US
dc.titleImproved anti-dust mite properties of textiles by eugenol loaded chitosan nanoparticlesen_US
dc.typeConference Paperen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=34548120159&origin=inwarden_US

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