Asymptotic analysis of the transient response of a thermoelastic assembly involving a thin layer

dc.contributor.authorLicht C.
dc.contributor.authorOrankitjaroen S.
dc.contributor.authorWeller T.
dc.contributor.otherMahidol University
dc.date.accessioned2023-06-18T17:12:03Z
dc.date.available2023-06-18T17:12:03Z
dc.date.issued2022-01-01
dc.description.abstractWe study the transient response of a thermoelastic structure made of two three-dimensional bodies connected by a thin adhesive layer. Once more we highlight the powerful flexibility of Trotter’s theory of approximation of semi-groups of operators acting on variable spaces: considering the geometrical and physical characteristics of the thin layer as parameters, we are able to show in a unitary way that this situation leads to a huge variety of limit models the properties of which are detailed. In particular, according to the relative behaviors of the different parameters involved, new features are evidenced such as the apparition of an added specific heat coefficient for the interface or of additional thermomechanical state variables defined not only on the limit geometric interface but on its cartesian product by any interval of real numbers.
dc.identifier.citationComptes Rendus - Mecanique Vol.350 (2022) , 27-45
dc.identifier.doi10.5802/crmeca.101
dc.identifier.eissn18737234
dc.identifier.issn16310721
dc.identifier.scopus2-s2.0-85148740168
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/84609
dc.rights.holderSCOPUS
dc.subjectEngineering
dc.titleAsymptotic analysis of the transient response of a thermoelastic assembly involving a thin layer
dc.typeArticle
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85148740168&origin=inward
oaire.citation.endPage45
oaire.citation.startPage27
oaire.citation.titleComptes Rendus - Mecanique
oaire.citation.volume350
oairecerif.author.affiliationLaboratoire de Mécanique et Génie Civil (LMGC)
oairecerif.author.affiliationMahidol University
oairecerif.author.affiliationMinistry of Higher Education, Science, Research and Innovation

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