Role of the smear layer in adhesive dentistry and the clinical applications to improve bonding performance
Issued Date
2022-11-01
Resource Type
ISSN
18827616
eISSN
22136851
Scopus ID
2-s2.0-85123700017
Journal Title
Japanese Dental Science Review
Volume
58
Start Page
59
End Page
66
Rights Holder(s)
SCOPUS
Bibliographic Citation
Japanese Dental Science Review Vol.58 (2022) , 59-66
Suggested Citation
Saikaew P., Sattabanasuk V., Harnirattisai C., Chowdhury A.F.M.A., Carvalho R., Sano H. Role of the smear layer in adhesive dentistry and the clinical applications to improve bonding performance. Japanese Dental Science Review Vol.58 (2022) , 59-66. 66. doi:10.1016/j.jdsr.2021.12.001 Retrieved from: https://repository.li.mahidol.ac.th/handle/123456789/84425
Title
Role of the smear layer in adhesive dentistry and the clinical applications to improve bonding performance
Other Contributor(s)
Abstract
Currently, dental adhesives can be divided into two systems; a smear layer-removal approach with etch-and-rinse adhesives or a smear layer-modified approach with self-etching adhesives. After phosphoric acid etching, the smear layer is completely removed. More attention is, however, required when using self-etching adhesives. The smear layer is partially demineralized by the weak acidic monomer and subsequently incorporated into the hybrid layer. Therefore, the characteristics of the smear layer play an important role on the bonding performance of self-etching adhesives. Such characteristics, for instance, smear layer thickness and smear layer density, are influenced by many factors, e.g., instruments used for dentin surface preparation, cutting speed, and the abrasive particle size of the cutting instruments. This review discusses the contributing factors that affect the smear layer characteristics, and the influence of the smear layer on the bonding performance of dental adhesives. Also, the application techniques regarding how to improve the bonding performance of self-etching adhesives – the smear layer removal by using chemical agents, or the modification of the adhesive application procedures – are provided.