Publication:
Bi(OTf)<inf>3</inf> Enabled C-F Bond Cleavage in HFIP: Electrophilic Aromatic Formylation with Difluoro(phenylsulfanyl)methane

dc.contributor.authorNolan M. Betterleyen_US
dc.contributor.authorSutthichat Kerdphonen_US
dc.contributor.authorSuppisak Chaturonrutsameeen_US
dc.contributor.authorSopanat Kongsriprapanen_US
dc.contributor.authorPanida Surawatanawongen_US
dc.contributor.authorDarunee Soorukramen_US
dc.contributor.authorManat Pohmakotren_US
dc.contributor.authorPher G. Anderssonen_US
dc.contributor.authorVichai Reutrakulen_US
dc.contributor.authorChutima Kuhakarnen_US
dc.contributor.otherKasetsart Universityen_US
dc.contributor.otherMahidol Universityen_US
dc.contributor.otherArrhenius Laboratoryen_US
dc.contributor.otherInternational Laboratories Corp.en_US
dc.date.accessioned2019-08-23T10:49:26Z
dc.date.available2019-08-23T10:49:26Z
dc.date.issued2018-08-01en_US
dc.description.abstract© 2018 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim Bismuth(III) trifluoromethanesulfonate [Bi(OTf)3] mediated mild electrophilic aromatic formylation utilizing difluoro(phenylsulfanyl)methane (PhSCF2H) as a formylating agent in hexafluoro-2-propanol (HFIP) as a recyclable ionizing solvent has been developed. The active formylating species was generated via C−F bond cleavage and was characterized to be a bis(phenylsulfanyl)methyl cation by experimental and computational 1H and 13C NMR.en_US
dc.identifier.citationAsian Journal of Organic Chemistry. Vol.7, No.8 (2018), 1642-1647en_US
dc.identifier.doi10.1002/ajoc.201800313en_US
dc.identifier.issn21935807en_US
dc.identifier.other2-s2.0-85051440073en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/123456789/45485
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85051440073&origin=inwarden_US
dc.subjectChemistryen_US
dc.titleBi(OTf)<inf>3</inf> Enabled C-F Bond Cleavage in HFIP: Electrophilic Aromatic Formylation with Difluoro(phenylsulfanyl)methaneen_US
dc.typeArticleen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85051440073&origin=inwarden_US

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