Publication: Self-etch or etch-and-rinse mode did not affect the microshear bond strength of a universal adhesive to primary dentin
Issued Date
2016-03-31
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ISSN
18811361
02874547
02874547
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2-s2.0-84961989861
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Mahidol University
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SCOPUS
Bibliographic Citation
Dental Materials Journal. Vol.35, No.2 (2016), 174-179
Suggested Citation
Benjaporn Thanaratikul, Busayarat Santiwong, Choltacha Harnirattisai Self-etch or etch-and-rinse mode did not affect the microshear bond strength of a universal adhesive to primary dentin. Dental Materials Journal. Vol.35, No.2 (2016), 174-179. doi:10.4012/dmj.2015-109 Retrieved from: https://repository.li.mahidol.ac.th/handle/20.500.14594/43568
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Title
Self-etch or etch-and-rinse mode did not affect the microshear bond strength of a universal adhesive to primary dentin
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Abstract
© 2016, Dental Materials Journal. All rights reserved. This study evaluated the microshear bond strength (μSBS) of resin composite to primary dentin using a universal adhesive in etchand- rinse mode or self-etch mode. Flat ground dentin surfaces were created on forty extracted human primary incisors and randomly assigned into four groups (n=10): Adper Single Bond II (ASB), Clearfil SE Bond (CSE), Single Bond Universal etch-and-rinse (SBUER) and Single Bond Universal self-etch (SBU-SE). Adhesive was applied on the dentin surface, which was subsequently bonded with a resin composite. The μSBS test was performed using a universal testing machine at a crosshead speed of 1 mm/min. The ASB group generated a lower mean μSBS (19.1±3.4 MPa) than those of the other groups [SBU-ER (24.3±2.7 MPa), SBU-SE (25.1±2.4 MPa), and CSE (25.3±2.7 MPa)]. Adhesive failure was the most common failure mode in each group. In conclusion, SBU used in etch-and-rinse or self-etch mode resulted in similar bond strength to primary dentin.