Publication:
Self-etch or etch-and-rinse mode did not affect the microshear bond strength of a universal adhesive to primary dentin

dc.contributor.authorBenjaporn Thanaratikulen_US
dc.contributor.authorBusayarat Santiwongen_US
dc.contributor.authorCholtacha Harnirattisaien_US
dc.contributor.otherChulalongkorn Universityen_US
dc.contributor.otherMahidol Universityen_US
dc.date.accessioned2018-12-11T02:43:07Z
dc.date.accessioned2019-03-14T08:04:37Z
dc.date.available2018-12-11T02:43:07Z
dc.date.available2019-03-14T08:04:37Z
dc.date.issued2016-03-31en_US
dc.description.abstract© 2016, Dental Materials Journal. All rights reserved. This study evaluated the microshear bond strength (μSBS) of resin composite to primary dentin using a universal adhesive in etchand- rinse mode or self-etch mode. Flat ground dentin surfaces were created on forty extracted human primary incisors and randomly assigned into four groups (n=10): Adper Single Bond II (ASB), Clearfil SE Bond (CSE), Single Bond Universal etch-and-rinse (SBUER) and Single Bond Universal self-etch (SBU-SE). Adhesive was applied on the dentin surface, which was subsequently bonded with a resin composite. The μSBS test was performed using a universal testing machine at a crosshead speed of 1 mm/min. The ASB group generated a lower mean μSBS (19.1±3.4 MPa) than those of the other groups [SBU-ER (24.3±2.7 MPa), SBU-SE (25.1±2.4 MPa), and CSE (25.3±2.7 MPa)]. Adhesive failure was the most common failure mode in each group. In conclusion, SBU used in etch-and-rinse or self-etch mode resulted in similar bond strength to primary dentin.en_US
dc.identifier.citationDental Materials Journal. Vol.35, No.2 (2016), 174-179en_US
dc.identifier.doi10.4012/dmj.2015-109en_US
dc.identifier.issn18811361en_US
dc.identifier.issn02874547en_US
dc.identifier.other2-s2.0-84961989861en_US
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/20.500.14594/43568
dc.rightsMahidol Universityen_US
dc.rights.holderSCOPUSen_US
dc.source.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84961989861&origin=inwarden_US
dc.subjectDentistryen_US
dc.subjectMaterials Scienceen_US
dc.titleSelf-etch or etch-and-rinse mode did not affect the microshear bond strength of a universal adhesive to primary dentinen_US
dc.typeArticleen_US
dspace.entity.typePublication
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84961989861&origin=inwarden_US

Files

Collections