Publication: Multifield analysis using multiple code coupling of a MEMS based micropump with biocompatible membrane materials for biomedical applications
Issued Date
2008-09-17
Resource Type
Other identifier(s)
2-s2.0-51549092304
Rights
Mahidol University
Rights Holder(s)
SCOPUS
Bibliographic Citation
BioMedical Engineering and Informatics: New Development and the Future - Proceedings of the 1st International Conference on BioMedical Engineering and Informatics, BMEI 2008. Vol.1, (2008), 531-535
Suggested Citation
Asim Nisar, Nitin Afzulpurkar, Banchong Mahaisavariya, Adisorn Tuantranont Multifield analysis using multiple code coupling of a MEMS based micropump with biocompatible membrane materials for biomedical applications. BioMedical Engineering and Informatics: New Development and the Future - Proceedings of the 1st International Conference on BioMedical Engineering and Informatics, BMEI 2008. Vol.1, (2008), 531-535. doi:10.1109/BMEI.2008.320 Retrieved from: https://repository.li.mahidol.ac.th/handle/20.500.14594/19138
Research Projects
Organizational Units
Authors
Journal Issue
Thesis
Title
Multifield analysis using multiple code coupling of a MEMS based micropump with biocompatible membrane materials for biomedical applications
Abstract
We present multifield analysis of a MEMS based piezoelectrically actuated valveless micropump with biocompatible polymer membrane materials for drug delivery applications, A three dimensional model of the micropump is built and fluid-structure interface effects have been taken into account in finite element analysis using multifield code coupling method. The dependency of the micropump characteristics on micropump dimensions and membrane and actuator materials is investigated. The analysis predicts that there is a definite relationship between membrane and piezoelectric layer thickness to obtain maximum pump flow. Diffuser geometrical dimensions such as diffuser length, diffuser neck width and diffuser angle play a critical to enhance the performance of the micropump and need to be optimized before fabrication. © 2008 IEEE.