Design Thinking Framework for Values Capturing and Technical Features Validation for Digital Healthcare Platform
dc.contributor.author | Ono K. | |
dc.contributor.author | Tangteerasunun P. | |
dc.contributor.other | Mahidol University | |
dc.date.accessioned | 2023-06-18T16:52:19Z | |
dc.date.available | 2023-06-18T16:52:19Z | |
dc.date.issued | 2022-01-01 | |
dc.description.abstract | For practitioners and platform developers, capturing values and validating of technical features of a large healthcare eco-system is a great challenge, due a large number of stakeholders and their complex relationship. This paper addresses this challenge by utilizing the design thinking as a framework. However, although design thinking is a well-proven customer-centric tool, implementation for a large platform is difficult. To solve this, a workflow incorporated stakeholder mapping, customer journey mapping, and value proposition canvas is proposed ensuring a systematic empathy, insights extraction, and ideation for technical features.As a study case, the proposed method is experimented during the development of the Thailand Health Dataspace (THDS), a digital healthcare platform enabling an integration of third-party stakeholders to public health dataspace. 529 participants from different stakeholder groups were involved. The proposed method has successfully provided a set of technical features while captured the values which each stakeholder is expecting from THDS. | |
dc.identifier.citation | 2022 IEEE Technology and Engineering Management Society Conference - Asia Pacific, TEMSCON-ASPAC 2022 (2022) , 75-78 | |
dc.identifier.doi | 10.1109/TEMSCON-ASPAC52831.2022.9916553 | |
dc.identifier.scopus | 2-s2.0-85141620573 | |
dc.identifier.uri | https://repository.li.mahidol.ac.th/handle/123456789/83990 | |
dc.rights.holder | SCOPUS | |
dc.subject | Business, Management and Accounting | |
dc.title | Design Thinking Framework for Values Capturing and Technical Features Validation for Digital Healthcare Platform | |
dc.type | Conference Paper | |
mu.datasource.scopus | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85141620573&origin=inward | |
oaire.citation.endPage | 78 | |
oaire.citation.startPage | 75 | |
oaire.citation.title | 2022 IEEE Technology and Engineering Management Society Conference - Asia Pacific, TEMSCON-ASPAC 2022 | |
oairecerif.author.affiliation | Mahidol University | |
oairecerif.author.affiliation | Ltd. |