Design Thinking Framework for Values Capturing and Technical Features Validation for Digital Healthcare Platform

dc.contributor.authorOno K.
dc.contributor.authorTangteerasunun P.
dc.contributor.otherMahidol University
dc.date.accessioned2023-06-18T16:52:19Z
dc.date.available2023-06-18T16:52:19Z
dc.date.issued2022-01-01
dc.description.abstractFor practitioners and platform developers, capturing values and validating of technical features of a large healthcare eco-system is a great challenge, due a large number of stakeholders and their complex relationship. This paper addresses this challenge by utilizing the design thinking as a framework. However, although design thinking is a well-proven customer-centric tool, implementation for a large platform is difficult. To solve this, a workflow incorporated stakeholder mapping, customer journey mapping, and value proposition canvas is proposed ensuring a systematic empathy, insights extraction, and ideation for technical features.As a study case, the proposed method is experimented during the development of the Thailand Health Dataspace (THDS), a digital healthcare platform enabling an integration of third-party stakeholders to public health dataspace. 529 participants from different stakeholder groups were involved. The proposed method has successfully provided a set of technical features while captured the values which each stakeholder is expecting from THDS.
dc.identifier.citation2022 IEEE Technology and Engineering Management Society Conference - Asia Pacific, TEMSCON-ASPAC 2022 (2022) , 75-78
dc.identifier.doi10.1109/TEMSCON-ASPAC52831.2022.9916553
dc.identifier.scopus2-s2.0-85141620573
dc.identifier.urihttps://repository.li.mahidol.ac.th/handle/123456789/83990
dc.rights.holderSCOPUS
dc.subjectBusiness, Management and Accounting
dc.titleDesign Thinking Framework for Values Capturing and Technical Features Validation for Digital Healthcare Platform
dc.typeConference Paper
mu.datasource.scopushttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85141620573&origin=inward
oaire.citation.endPage78
oaire.citation.startPage75
oaire.citation.title2022 IEEE Technology and Engineering Management Society Conference - Asia Pacific, TEMSCON-ASPAC 2022
oairecerif.author.affiliationMahidol University
oairecerif.author.affiliationLtd.

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